Yavne, Israel — January 31, 2018 — Highcon Systems Ltd., announced today the sale of a Highcon Beam digital cutting and creasing system to Haubtmann, Autajon Packaging site located close Continue ReadingAutajon Moves Into Digital With Highcon Beam→
The post Autajon Moves Into Digital With Highcon Beam appeared first on Industry Analysts, Inc..
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The post Autajon Moves Into Digital With Highcon Beam appeared first on Industry Analysts, Inc..
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