(PR-inside.com) Today, KLA-Tencor Corporation (NASDAQ:KLAC) introduced the TeraScanXR, bringing high-resolution reticle-, aerial- and wafer-plane inspection capability to the 32nm node. This new tool, an extension of existing TeraScan reticle inspection systems, is designed to provide mask manufacturers better sensitivity, lower cost-per-inspection and faster mask dispositioning. In addition, the TeraScanXR is the only reticle inspection tool on the market to supply the complete set of inspection planes: high resolution reticle-plane inspection (RPI) to capture process defects during development and manufacturing; aerial-plane inspection (API) to filter out certain non-printing defects; and wafer-plane inspection (WPI) to predict which reticle defects will print on the ..
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