(PR-inside.com) Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today the availability of the new Wafer Scanner : http://cts.businesswire.com/ct/CT?id...368c219bcfd895http://cts.businesswire.com/ct/CT?id...5fba085ef9d349 . The WS 3880 provides 3D (height) and 2D measurement and inspection of micro and standard bumps : http://cts.businesswire.com/ct/CT?id...6a3ed7526fe449 , through silicon via (TSV) : http://cts.businesswire.com/ct/CT?id...7c22231b729556 post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used ..
More...
More...